4.4 Article

Impact of interface resistance on pulsed thermoelectric cooling

出版社

ASME
DOI: 10.1115/1.2780186

关键词

thermoelectric; interface effect; microscale heat transfer; cooling; energy harvesting

向作者/读者索取更多资源

Pulsed thermoelectric cooling is an attractive approach for the site specific thermal management of infrared sensors and other low-heat flux devices. Intense Joule heating caused by electrical interface resistance, however can severely degrade pulsed cooling performance. Numerical simulations are used to quantify the impact of the interface resistance on pulsed thermoelectric cooling. The degradation in performance is most pronounced for microcoolers that have small bulk resistivity at high pulse amplitudes. Our work also forms a basis for new techniques to probe interfaces in TE devices for energy harvesting as well as cooling applications.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.4
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据