期刊
JOURNAL OF HAZARDOUS MATERIALS
卷 163, 期 2-3, 页码 1019-1025出版社
ELSEVIER
DOI: 10.1016/j.jhazmat.2008.07.099
关键词
Waste printed circuit board; Moulding parameters; Mechanical properties
资金
- National High Technology Research and Development Program of China [2006AA06Z364]
- Program for New Century Excellent Talents in University and Research Fund for the Doctoral Program of Higher Education [20060248058]
The aim of this study was to present a new method for resource utilization of nonmetallic materials reclaimed from pulverized waste printed circuit boards, A reproduction nonmetallic plate (RNMP) was prepared by adding resin paste, glass fiber and additives into nonmetallic materials using self-made hot-press former. Principle of manufacturing process and effects Of Mould temperature and moulding time on the mechanical properties of RNMP were studied. The results showed that when moulding pressure was fixed at 6 MPa, the Optimum conditions for the RNMP were as follows: 140/135 degrees C for top/bottom mould temperature. 5 min for moulding time. The maximum content of nonmetallic materials in RNMP was up to 40 wt%. When nonmetallic material content was 20 wt%, the RNMP moulded at optimum conditions had excellent mechanical properties, with impact strength of 5.8 kJ/m(2) and flexural strength of 65.1 MPa. (C) 2008 Elsevier B.V. All rights reserved.
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