相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。Comparison of mode-resolved fracture strength of silicon with mixed-mode failure of diamond crystals
Victor V. Kozhushko et al.
ENGINEERING FRACTURE MECHANICS (2010)
Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer
Xiaoping Li et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2010)
Effect of crystallographic orientation on phase transformations during indentation of silicon
Y. B. Gerbig et al.
JOURNAL OF MATERIALS RESEARCH (2009)
Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining
Jiwang Yan et al.
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2009)
Critical depth of cut and specific cutting energy of a microscribing process for hard and brittle materials
Jiunn-Jyh Junz Wang et al.
JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME (2008)
High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer
M. B. Cai et al.
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE (2007)
The mechanism of ductile chip formation in cutting of brittle materials
K. Liu et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2007)
An experimental study of edge radius effect on cutting single crystal silicon
FZ Fang et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2003)
Raman microspectroscopy analysis of pressure-induced metallization in scratching of silicon
Y Gogotsi et al.
SEMICONDUCTOR SCIENCE AND TECHNOLOGY (2001)
Some experiments on the scratching of silicon: In situ scratching inside an SEM and scratching under high external hydrostatic pressures
M Yoshino et al.
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES (2001)
分享论文
