期刊
JOURNAL OF ELECTRONIC PACKAGING
卷 133, 期 2, 页码 -出版社
ASME-AMER SOC MECHANICAL ENG
DOI: 10.1115/1.4004094
关键词
carbon nanotubes; elemental semiconductors; interface structure; mechanical stability; MIS structures; organic compounds; palladium compounds; photoacoustic effect; silicon; silver; thermal conductivity; welds
资金
- Department of Science and Technology, Government of India
- Raytheon as part of the DARPA
Carbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which free CNT ends are bonded using Pd hexadecanethiolate, Pd(SC(16)H(35))(2), to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The Pd weld is particularly attractive for its mechanical stability at high temperatures. A transient photoacoustic (PA) method is used to measure the thermal resistance of the palladium-bonded CNT interfaces. The interfaces were bonded at moderate pressures and then tested at 34 kPa using the PA technique. At an interface temperature of approximately 250 degrees C, one-sided and two-sided palladium-bonded interfaces achieved thermal resistances near 10 mm(2) K/W and 5 mm(2) K/W, respectively. [DOI: 10.1115/1.4004094]
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