相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。Shorter field life-in power cycling for organic packages
S. B. Park et al.
JOURNAL OF ELECTRONIC PACKAGING (2007)
Application of Moire interferometry to determine strain fields and debonding of solder joints in BGA packages
H Liu et al.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES (2004)
Effect of simulation methodology on solder joint crack growth correlation and fatigue life prediction
R Darveaux
JOURNAL OF ELECTRONIC PACKAGING (2002)
Thermal cycling analysis of flip-chip solder joint reliability
JHL Pang et al.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES (2001)
Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models
JHL Pang et al.
IEEE TRANSACTIONS ON ADVANCED PACKAGING (2001)
On the design parameters of flip-chip PBGA package assembly for optimum solder ball reliability
K Verma et al.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES (2001)
Accelerated thermal cycling and failure mechanisms for BGA and CSP assemblies
R Ghaffarian
JOURNAL OF ELECTRONIC PACKAGING (2000)
CBGA solder joint reliability evaluation based on elastic-plastic-creep analysis
JHL Pang et al.
JOURNAL OF ELECTRONIC PACKAGING (2000)