相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。Cyclic twin nucleation in tin-based solder alloys
L. P. Lehman et al.
ACTA MATERIALIA (2010)
The Role of Recrystallization in the Failure of SnAgCu Solder Interconnections Under Thermomechanical Loading
Toni Tuomas Mattila et al.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES (2010)
Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy
Jicheng Gong et al.
JOURNAL OF ELECTRONIC MATERIALS (2009)
Correlations Between the Microstructure and Fatigue Life of Near-Eutectic Sn-Ag-Cu Pb-Free Solders
Babak Arfaei et al.
JOURNAL OF ELECTRONIC MATERIALS (2009)
Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints
Thomas R. Bieler et al.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES (2008)
Recrystallization behaviour of SnAgCu solder joints
Janne J. Sundelin et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2008)
Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder
M. Erinc et al.
MECHANICS OF MATERIALS (2008)
Microstructure characterization and creep behavior of Pb-free Sn-rich solder alloys: Part II. Creep behavior of bulk solder and solder/copper joints
R. S. Sidhu et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2008)
Three-dimensional investigation of particle-stimulated nucleation in a nickel alloy
W. Xu et al.
ACTA MATERIALIA (2007)
Damage produced in solder alloys during thermal cycling
X. W. Liu et al.
JOURNAL OF ELECTRONIC MATERIALS (2007)
Pb-free solder:: New materials considerations for microelectronics processing
Peter Borgesen et al.
MRS BULLETIN (2007)
Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint
A. U. Telang et al.
ACTA MATERIALIA (2007)
Thermomechanical fatigue damage evolution in SAC solder joints
M. A. Matin et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2007)
Isothermal fatigue behavior of the near-eutectic Sn-Ag-Cu alloy between-25°C and 125°C
Tia-Marje K. Korhonen et al.
JOURNAL OF ELECTRONIC MATERIALS (2007)
Deformation behavior of tin and some tin alloys
Fuqian Yang et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2007)
Grain boundary sliding on near-7°, 14°, and 22° special boundaries during thermornechanical cycling in surface-mount lead-free solder joint specimens
AU Telang et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2006)
Reliability of lead-free interconnections under consecutive thermal and mechanical loadings
TT Mattila et al.
JOURNAL OF ELECTRONIC MATERIALS (2006)
Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders
I Dutta et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2005)
Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys
R Kinyanjui et al.
JOURNAL OF MATERIALS RESEARCH (2005)
Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy
MA Matin et al.
SCRIPTA MATERIALIA (2005)
Microstructural evolution in lead-free solder alloys: Part I. Cast Sn-Ag-Cu eutectic
SL Allen et al.
JOURNAL OF MATERIALS RESEARCH (2004)
Microstructural evolution in lead-free solder alloys: Part II. Directionally solidified Sn-Ag-Cu, Sn-Cu and Sn-Ag
SL Allen et al.
JOURNAL OF MATERIALS RESEARCH (2004)
Recrystallization of sn grains due to thermal strain in Sn-1.2Ag-0.5Cu-0.05Ni solder
S Terashima et al.
MATERIALS TRANSACTIONS (2004)
Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder
LP Lehman et al.
JOURNAL OF ELECTRONIC MATERIALS (2004)
The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue
DW Henderson et al.
JOURNAL OF MATERIALS RESEARCH (2004)
A constitutive model for creep of lead-free solders undergoing strain-enhanced microstructural coarsening: A first report
I Dutta
JOURNAL OF ELECTRONIC MATERIALS (2003)
Ag3Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys
DW Henderson et al.
JOURNAL OF MATERIALS RESEARCH (2002)
Particle stimulated nucleation of recrystallization at silica particles in nickel
FJ Humphreys
SCRIPTA MATERIALIA (2000)