期刊
JOURNAL OF ELECTRONIC MATERIALS
卷 38, 期 12, 页码 2720-2725出版社
SPRINGER
DOI: 10.1007/s11664-009-0918-9
关键词
Lead-free; electronics packaging; low temperature; nanoparticle solder; electromigration
资金
- National Science Foundation
- Intel Robert N. Noyce Fellowship in Microelectronics
Gold nanoparticle inks were investigated as a potential candidate for lead-free packaging applications. Inks consisted of surfactant-passivated nanoparticles dissolved in a solvent. Optimized gold inks are able to sinter at temperatures as low as 120A degrees C and achieve conductivities of up to 70% of bulk. Once sintered, the metallic structure reverts to bulk-like properties and approaches bulk reliability and performance. Thus nanoparticle-based solders would operate at much lower homologous temperatures as compared with alloy-based solders. Nanoparticle inks under investigation were sintered at 180A degrees C. The resulting material exhibited a resistivity of 5 mu Omega cm, which is significantly lower than those of Pb-Sn and Sn-Ag-Cu. Electromigration studies were carried out and time to failure was investigated as a function of temperature. Electromigration activation energy was calculated through Black's equation to be 0.52 eV, which is consistent with surface/grain boundary diffusion. These studies suggest that nanoparticle-ink-based films show excellent robustness, due to their irreversible conversion to bulk-like materials. Nanoparticle inks are thus promising candidates for next-generation lead-free solders.
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