Electrochemical Migration Characteristics of Eutectic Sn-Pb Solder Alloy in NaCl and Na2SO4 Solutions

Anodic dissolution and the electrochemical migration characteristics of eutectic Sn-Pb solder alloy in deaerated 0.001% NaCl and Na2SO4 solutions were investigated using anodic polarization and water drop tests. Anodic polarization results revealed that a Pb-rich phase was preferentially ionized in deaerated 0.001% NaCl solution and an Sn-rich phase was predominantly ionized in deaerated 0.001% Na2SO4 solution, which coincides well with the composition of the dendrites formed during water drop tests. X-ray diffraction and photoelectron spectroscopy results showed that the surface oxide film formed on pure Sn in deaerated 0.001% NaCl solution is more stable than that formed on pure Sn in deaerated 0.001% Na2SO4 solution. The surface oxide film formed on pure Pb in deaerated 0.001% Na2SO4 solution is more stable than that formed on pure Sn in deaerated 0.001% NaCl solution. Therefore, the quality of the surface film of eutectic Sn-Pb solder in a chemical environment seems to be critical not only for corrosion resistance, but also for electrochemical migration resistance.