期刊
JOURNAL OF ELECTRONIC MATERIALS
卷 38, 期 7, 页码 1252-1256出版社
SPRINGER
DOI: 10.1007/s11664-008-0627-9
关键词
Thermoelectric cooler; self-assembly; Monte Carlo simulation; bismuth telluride
Optimum thermoelectric cooling (TEC) solutions often require the integration of component sizes inaccessible by common manufacturing techniques such as thin-film processing and robotic assembly. This work considers an application case in which small elements (100 mu m to 300 mu m thick) are optimal. A capillary self-assembly process is presented as a potential route to manufacturing TECs in these size ranges. A millimeter-scale demonstration of the assembly concept is presented and Monte Carlo simulation is used to study the scaling of the self-assembly approach to assemblies with more components. While assembly rate and system yield can be a challenge, several approaches are presented for increasing both rate and yield.
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