期刊
JOURNAL OF ELECTRONIC MATERIALS
卷 38, 期 1, 页码 33-38出版社
SPRINGER
DOI: 10.1007/s11664-008-0560-y
关键词
Lead-free solder; Sn-Ag-Cu; thermal fatigue; grain boundary character distribution; orientation imaging microscopy
Thermal fatigue properties of commercial LF35 (Sn-1.2Ag-0.5Cu-0.05Ni), SAC105 (Sn-1Ag-0.5Cu), and SAC305 (Sn-3Ag-0.5Cu) solders on Casio's wafer-level packages are discussed from the viewpoints of both morphology and grain boundary character. Orientation imaging microscopy revealed that both LF35 and SAC305 resisted the coarsening of tin grains during thermal fatigue as compared with SAC105, correlating with their greater fraction of coincidence site lattice boundaries. This seems to explain why LF35 has superior thermal fatigue life in spite of its lower silver content.
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