期刊
JOURNAL OF DENTAL RESEARCH
卷 89, 期 12, 页码 1505-1509出版社
SAGE PUBLICATIONS INC
DOI: 10.1177/0022034510384871
关键词
ultra-mild self-etch adhesive; adhesion; resin-smear complex; enamel; TEM; smear layer; hybrid layer
资金
- FWO [G.0206.07]
- K.U. Leuven [OT/06/55]
- Government of Flanders
- Grants-in-Aid for Scientific Research [22592120] Funding Source: KAKEN
In light of the increased popularity of less acidic, so-called 'ultra-mild' self-etch adhesives, adhesion to enamel is becoming more critical. It is hypothesized that this compromised enamel bonding should, to a certain extent, be attributed to interference of bur debris smeared across enamel during cavity preparation. High-resolution transmission electron microscopy revealed that the enamel smear layer differed not only in thickness, but also in crystal density and size, depending on the surface-preparation method used. Lab-demineralization of sections clearly disclosed that resin-infiltration of an ultra-mild self-etch adhesive progressed preferentially along micro-cracks that were abundantly present at and underneath the bur-cut enamel surface. The surface-preparation method significantly affected the nature of the smear layer and the interaction with the ultra-mild adhesive, being more uniform and dense for a lab-SiC-prepared surface vs. a clinically relevant bur-prepared surface.
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