4.7 Article

Silica encapsulation of n-octadecane via sol-gel process: A novel microencapsulated phase-change material with enhanced thermal conductivity and performance

期刊

JOURNAL OF COLLOID AND INTERFACE SCIENCE
卷 343, 期 1, 页码 246-255

出版社

ACADEMIC PRESS INC ELSEVIER SCIENCE
DOI: 10.1016/j.jcis.2009.11.036

关键词

Silica microcapsules; n-Octadecane; Sol-gel process; Thermal conductivity; Phase-change performance

资金

  1. National Key Technology R&D Program for the 11th Five-Year Plan [2008BAE59B04]
  2. National Nature Science Foundation of China [50973005]

向作者/读者索取更多资源

A novel microencapsulated phase-change material (PCM) based on an n-octadecane core and an inorganic silica shell was designed to enhance thermal conductivity and phase-change performance. These silica microcapsules were synthesized by using TEOS as an inorganic Source through a sol-gel process. Fourier transform infrared spectra confirm that the silica shell material Was Successfully fabricated onto the surface of the n-octadecane core. Scanning electronic microscopy images Suggest that the silica microcapsules exhibit a spherical morphology with a well-defined core-shell microstructure. Furthermore, the silica microcapsules synthesized at pH 2.45 display a smooth and compact surface. These microcapsules also present a large particle size range of 7-16 mu m. Wide-angle X-ray scattering patterns indicate that the n-octadecane inside the silica microcapsules still retains a good Crystallinity. Thermogravimetric analysis shows that these silica microcapsules are degraded in two distinct steps, and have good thermal stability. The silica-microencapsulated n-octadecane can achieve good phase-change performance, high encapsulation efficiency, and good antiosmosis property by controlling the loading of core material and acidity of the reaction solution during the sol-gel process. The thermal conductivity of the microencapsulated n-octadecane is also significantly enhanced due to the presence of the high thermal Conductive silica shell. (c) 2009 Elsevier Inc. All rights reserved.

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