期刊
JOURNAL OF COLLOID AND INTERFACE SCIENCE
卷 329, 期 1, 页码 208-211出版社
ACADEMIC PRESS INC ELSEVIER SCIENCE
DOI: 10.1016/j.jcis.2008.09.059
关键词
Superhydrophobic; Copper substrate; Replacement
资金
- National Natural Science Foundation of PR China [50875108, 20573041, 50635030]
- Program for Changjiang Scholars and Innovative Research Team in University (PCSIRT) [IRT0422]
- Program for New Century Excellent Talents in University (NCET)
- 111 Project [B06009]
Using an electroless replacement deposition method, large-area superhydrophobic metal substrate Could be obtained. The superhydrophobic surfaces were prepared via a replacement reaction between copper Substrate and HAuCl4 solution. The roughness of the copper substrate increased much after the replacement reaction. X-ray powder diffraction (XRD) pattern and energy dispersive X-ray (EDX) spectroscopy have proved that gold, CuCl and Cu2O formed on the Surface of copper substrate after the replacement reaction. The surface showed remarkable superhydrophobic properties with a contact angle higher than 150 degrees without any modification with a self-assembled monolayer (SAM) of long chain thiol or perfluoro molecules. (c) 2008 Elsevier Inc. All rights reserved.
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