4.7 Article

Automated detection and quantification of hidden voids in triplex bonding layers using active lock-in thermography

期刊

NDT & E INTERNATIONAL
卷 74, 期 -, 页码 94-105

出版社

ELSEVIER SCI LTD
DOI: 10.1016/j.ndteint.2015.05.004

关键词

Active lock-in thermography; Hidden void detection and quantification; Non-uniform thermal distribution compensation; Binary image processing; Empirical void size mapping

资金

  1. HHI-KAIST Cooperative Research Program of Hyundai Heavy Industries Inc.
  2. Mid-career Researcher Program of the National Research Foundation of Korea (NRF) - Ministry of Education, Science and Technology [2010-0017456]

向作者/读者索取更多资源

This paper presents an automated hidden void detection and quantification technique for inspecting triplex bonding layers in liquefied natural gas (LNG) carriers using active lock-in thermography. Hidden voids are first detected and visualized by an amplitude image and a series of binary image processing. Then, the sizes of the detected voids are quantified using an empirical mapping function, relating the detected void sizes to the void sizes obtained by an independent X-ray testing. The performance of the proposed technique is blind tested using two triplex specimens. The experimental results reveal that the hidden voids can be successfully detected and quantified. (C) 2015 Elsevier Ltd. All rights reserved.

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