4.6 Article

Experimental Investigation into the Effect of Adhesion Properties of PEEK Modified by Atmospheric Pressure Plasma and Low Pressure Plasma

期刊

JOURNAL OF APPLIED POLYMER SCIENCE
卷 118, 期 1, 页码 173-179

出版社

WILEY-BLACKWELL
DOI: 10.1002/app.31880

关键词

polyether ether ketone (PEEK); epoxy adhesive (DURALCO 4703); low pressure plasma; atmospheric pressure plasma; SEM; adhesive bond; strength

资金

  1. AICTE New Delhi, India [F.8023/BOR/RID/RPS-243/2008-09]

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High performance polymer, Polyether Ether Ketone (PEEK) (service temperature -250 degrees C to +300 degrees C, tensile strength: 120 MPa) is gaining significant interest in aerospace and automotive industries. In this investigation, attention is given to understand adhesion properties of PEEK, when surface of the PEEK is modified by two different plasma processes (i) atmospheric pressure plasma and (ii) low pressure plasma under DC Glow Discharge. The PEEK sheets are fabricated by ultra high temperature resistant epoxy adhesive (DURALCO 4703, service temperature -260 degrees C to +350 degrees C). The surface of the PEEK is modified through atmospheric pressure plasma with 30 and 60 s of exposure and low pressure plasma with 30, 60, 120, 240, and 480 s of exposure. It is observed that polar component of surface energy leading to total surface energy of the polymer increases significantly when exposed to atmospheric pressure plasma. In the case of low pressure plasma, polar component of surface energy leading to total surface energy of the polymer increases with time of exposure up to 120 s and thereafter, it deteriorates with increasing time of exposure. The fractured surface of the adhesively bonded PEEK is examined under SEM. It is observed that unmodified PEEK fails essentially from the adhesive to PEEK interface resulting in low adhesive bond strength. In the case of surface modified PEEK under atmospheric pressure plasma, the failure is entirely from the PEEK and essentially tensile failure at the end of the overlap resulting in significant increase in adhesive bond strength. (C) 2010 Wiley Periodicals, Inc. J Appl Polym Sci 118: 173-179, 2010

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