Diffusion bonding of aluminum-magnesium using cold rolled copper interlayer

Diffusion bonding, due to improving the dispersion of brittle intermetallic compounds, reducing the process energy and increasing the bonding strength of aluminum-magnesium joints, is widely used. In the present study, the commercially pure aluminum and magnesium bulks were successfully diffusion bonded at different strain values (0, 30 and 60%) at 480 degrees C and different holding times in two cases of without interlayer and with cold rolled copper interlayers. The results of the microstructural study using scanning electron microscopy (SEM) showed that, in interlayer-used bonding, the increase in the strain value of copper interlayer led to a wider joint diffusion layer. The results of the micro hardness test indicated that the hardness of the bonding interface in interlayer-used bonding, decreased in comparison with the non-interlayer bonding state. Moreover, the shear strength test showed that, as the holding time in the non-interlayer state increased, the strength decreased and in the case of interlayer-used bonding, increased time and strain resulted in increased strength of the Al-Mg bond. By rolling the interlayer to different values, the structural and mechanical properties of the Al-Mg diffusion bonding can be adjusted. (C) 2018 Elsevier B.V. All rights reserved.