期刊
JOURNAL OF ALLOYS AND COMPOUNDS
卷 563, 期 -, 页码 143-149出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2013.02.100
关键词
Solidification; Microstructure; Precipitation; Superalloy; TLP bonding
This paper addresses solidification and solid state precipitation phenomena during transient liquid phase (TLP) bonding of wrought IN718 nickel base superalloy using Ni-4.5Si-3.2B (wt.%) ternary filler alloy. The solidification sequence of the residual liquid in the joint centerline was found to be (1) formation of proeutectic gamma, followed by (2) gamma/Ni3B eutectic reaction, followed by (3) ternary eutectic of gamma/Ni3B/Ni6Si2B. Extensive fine Ni3Si formed within the eutectic-gamma via solid state precipitation during cooling. Extensive Cr-Mo-Nb rich boride precipitates were formed in the substrate region due to boron diffusion into the base metal during bonding process. The implications of the phase transformations on the mechanical properties, corrosion resistance and aging behavior of the joint, which are pertinent to the development of an optimum post bond heat treatment, are highlighted. (C) 2013 Elsevier B.V. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据