期刊
JOURNAL OF ALLOYS AND COMPOUNDS
卷 562, 期 -, 页码 194-204出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2013.02.050
关键词
Sn-Ag solder alloys; Ag3Sn; Mechanical properties; Cooling rate; Solidification
资金
- CNPq
- FAE-PEX/Funcamp (Foundation of the University of Campinas, Unicamp)
- FAPESP, Brazil
The aim of this experimental investigation is to evaluate the tensile properties of as-cast Sn-Ag alloys as a function of both the resulting secondary dendritic arm spacings and the morphology of the Ag3Sn IMC (intermetallic compound). This comparative experimental investigation was carried out with a view to assess the application of Sn-Ag alloys as alternative solder materials. A directional water-cooled solidification apparatus was used to obtain the as-cast samples. The resulting microstructures, ultimate and yield tensile strengths and elongation of Sn-2 wt.% Ag and Sn-3.5 wt.% Ag alloys were experimentally determined and compared with the corresponding results of the traditional Sn-40 wt.% Pb solder alloy. It was found that the Sn-Ag alloys examined comply with the compromise between compatible mechanical strength and environmental protection. (C) 2013 Elsevier B. V. All rights reserved.
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