期刊
JOURNAL OF ALLOYS AND COMPOUNDS
卷 581, 期 -, 页码 202-205出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2013.07.058
关键词
Intermetallics; Atomic diffusion; Composite materials
资金
- National Natural Science Foundation of China [51074112, 11247224]
- Key Program of Tianjin Natural Science Foundation [11JCZDJC22100]
The electromigration behaviors of line-type Cu/Sn-Ag-Cu/Cu interconnects with and without Ni-Coated multi-walled Carbon Nanotubes addition were investigated in this work. After soldering, the (Cu, Ni)(6)Sn-5 intermetallic compounds formed at the solder/Cu interface. The electromigration analysis shows that the presence of Carbon Nanotubes can suppress the atomic diffusion in the solder induced by electromigration effectively. And finite element simulation indicates that the Carbon Nanotube networks can reduce the current density in the solder matrix, which results in the improvement of electromigration resistance of composite solders. (C) 2013 Elsevier B. V. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据