期刊
JOURNAL OF ALLOYS AND COMPOUNDS
卷 509, 期 5, 页码 1785-1789出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2010.10.040
关键词
Bi segregation; Interconnect; Kinetics; Intermetallic compound growth
资金
- National Science Foundation of China [50871026]
- 111 Project [B07015]
- Foundation for the Author of National Excellent Doctoral Dissertation of PR China [200745]
- Program for New Century Excellent Talents in University [NCET-06-0288]
- Fundamental Research Funds for the Central Universities [N090109001]
There was a sudden increase of intermetallic compound (IMC) Cu6Sn5 growth rate in the eutectic Sn58wt. %Bi/Cu joint during aging process. With aging time increasing, Bi accumulated at the Cu3Sn/Cu interface and gradually induced the fracture mode of the joint to change from ductile to brittle one along this interface. Bi segregation enhanced IMC Cu6Sn5 growth by means of promoting the interfacial reaction at Cu3Sn/Cu interface, which was concluded from IMCs (Cu6Sn5 and Cu3Sn) growth behavior for pure Sn/Cu and Sn10wt. %Bi/Cu interconnects at the same temperature. (C) 2010 Elsevier B.V. All rights reserved.
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