4.7 Article

Solid Inclusion Complexes of Vanillin with Cyclodextrins: Their Formation, Characterization, and High-Temperature Stability

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JOURNAL OF AGRICULTURAL AND FOOD CHEMISTRY
卷 59, 期 21, 页码 11772-11778

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AMER CHEMICAL SOC
DOI: 10.1021/jf202915c

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  1. UNAM-Institute of Materials Science and Nanotechnology
  2. EU
  3. TUBITAK
  4. [FP7-PEOPLE-2009-RG]
  5. [PIRG06-GA-2009 256428]

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This study reports the formation of solid vanillin/cyclodextrin inclusion complexes (vanillin/CD ICs) with the aim to enhance the thermal stability and sustained release of vanillin by inclusion complexation. The solid vanillin/CD ICs with three types of CDs (alpha-CD, beta-CD, and gamma-CD) were prepared using the freeze-drying method; in addition, a coprecipitation method was also used in the case of gamma-CD. The presence of vanillin in CD ICs was confirmed by FTIR and H-1 NMR studies. Moreover, H-1 NMR study elucidated that the complexation stoichiometry for both vanillin/beta-CD IC and vanillin/gamma-CD IC was a 1:1 molar ratio, whereas it was 0.625:1 for vanillin/alpha-CD IC. XRD studies have shown channel-type arrangement for CD molecules, and no diffraction peak for free vanillin was observed for vanillin/beta-CD IC and vanillin/gamma-CD IC, indicating that complete inclusion complexation was successfully achieved for these CD ICs. In the case of vanillin/alpha-CD IC, the sample was mostly amorphous and some uncomplexed vanillin was present, suggesting that alpha CD was not very effective for complexation with vanillin compared to beta-CD and gamma-CD. Furthermore, DSC studies for vanillin/beta-CD IC and vanillin/gamma-CD IC have shown no melting point for vanillin, elucidating the true complex formation, whereas a melting point for vanillin was recorded for vanillin/alpha-CD IC, confirming the presence of some uncomplexed vanillin in this sample. TGA thermograms indicated that thermal evaporation/degradation of vanillin occurred over a much higher temperature range (150-300 degrees C) for vanillin/CD ICs samples when compared to pure vanillin (80-200 degrees C) or vanillin/CD physical mixtures, signifying that the thermal stability of vanillin was increased due to the inclusion complexation with CDs. Moreover, headspace GC-MS analyses indicated that the release of vanillin was sustained at higher temperatures in the case of vanillin/CD ICs due to the inclusion complexation when compared to vanillin/CD physical mixtures. The amount of vanillin released with increasing temperature was lowest for vanillin/gamma-CD IC and highest for vanillin/alpha-CD IC, suggesting that the strength of interaction between vanillin and the CD cavity was in the order gamma-CD > beta-CD > alpha-CD for solid vanillin/CD ICs.

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