相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。4-nm thick multilayer structure of multi-component (AlCrRuTaTiZr)Nx as robust diffusion barrier for Cu interconnects
Shou-Yi Chang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2012)
Mechanical performance and nanoindenting deformation of (AlCrTaTiZr)NCy multi-component coatings co-sputtered with bias
Shao-Yi Lin et al.
SURFACE & COATINGS TECHNOLOGY (2012)
Property improvement of Cu-Zr alloy films with ruthenium addition for Cu metallization
Ying Wang et al.
ACTA MATERIALIA (2011)
Ru incorporation on marked enhancement of diffusion resistance of multi-component alloy barrier layers
Shou-Yi Chang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2011)
Ultrathin Ru-Ta-C Barriers for Cu Metallization
J. S. Fang et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2011)
Microstructures and mechanical properties of multi-component (AlCrTaTiZr)NxCy nanocomposite coatings
Shou-Yi Chang et al.
THIN SOLID FILMS (2011)
Ultrathin (AlCrTaTiZr)N-x/AlCrTaTiZr Bilayer Structures with High Diffusion Resistance for Cu Interconnects
Shou-Yi Chang et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2010)
Atomic-scale mechanisms for diffusion of impurities in transition-metal nitrides
L. Tsetseris et al.
SURFACE & COATINGS TECHNOLOGY (2010)
Mechanical properties, deformation behaviors and interface adhesion of (AlCrTaTiZr)Nx multi-component coatings
Shou-Yi Chang et al.
SURFACE & COATINGS TECHNOLOGY (2010)
Migration of species in a prototype diffusion barrier: Cu, O, and H in TiN
L. Tsetseris et al.
APPLIED PHYSICS LETTERS (2009)
10-nm-thick quinary (AlCrTaTiZr)N film as effective diffusion barrier for Cu interconnects at 900 °C
Shou-Yi Chang et al.
APPLIED PHYSICS LETTERS (2009)
Multiprincipal-Element AlCrTaTiZr-Nitride Nanocomposite Film of Extremely High Thermal Stability as Diffusion Barrier for Cu Metallization
Shou-Yi Chang et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2009)
Failure Mechanism of 5 nm Thick Ta-Si-C Barrier Layers Against Cu Penetration at 750-800 degrees C
Jau-Shiung Fang et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2009)
Acoustic vibrations of anisotropic nanoparticles
Lucien Saviot et al.
PHYSICAL REVIEW B (2009)
Ru thin film grown on TaN by plasma enhanced atomic layer deposition
Qi Xie et al.
THIN SOLID FILMS (2009)
Ir/TaN as a bilayer diffusion barrier for advanced Cu interconnects
L. C. Leu et al.
APPLIED PHYSICS LETTERS (2008)
A bilayer diffusion barrier of ALD-Ru/ALD-TaCN for direct plating of Cu
Soo-Hyun Kim et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2008)
Improvement on the diffusion barrier performance of reactively sputtered Ru-N film by incorporation of Ta
Chun-Wei Chen et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2008)
Thermal stability of Ti/Mo and Ti/MoN nanostructures for barrier applications in Cu interconnects
Prodyut Majumder et al.
NANOTECHNOLOGY (2008)
Anomalous decrease in X-ray diffraction intensities of Cu-Ni-Al-Co-Cr-Fe-Si alloy systems with multi-principal elements
Jien-Wei Yeh et al.
MATERIALS CHEMISTRY AND PHYSICS (2007)
Preparation and characterization of AlCrTaTiZr multi-element nitride coatings
Chia-Han Lai et al.
SURFACE & COATINGS TECHNOLOGY (2006)
Plasma-enhanced atomic layer deposition of Ru-TiN thin films for copper diffusion barrier metals
SH Kwon et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2006)
Mechanical performance of the AlxCoCrCuFeNi high-entropy alloy system with multiprincipal elements
CJ Tong et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2005)
Microstructure characterization of AlxCoCrCuFeNi high-entropy alloy system with multiprincipal elements
CJ Tong et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2005)
5 nm ruthenium thin film as a directly plateable copper diffusion barrier
TN Arunagiri et al.
APPLIED PHYSICS LETTERS (2005)
Atomic layer deposition of molybdenum nitride thin films for Cu metallizations
P Alen et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2005)
Formation of simple crystal structures in Cu-Co-Ni-Cr-Al-Fe-Ti-V alloys with multiprincipal metallic elements
JW Yeh et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2004)
Nanostructured high-entropy alloys with multiple principal elements: Novel alloy design concepts and outcomes
JW Yeh et al.
ADVANCED ENGINEERING MATERIALS (2004)
Improved diffusion barrier by stuffing the grain boundaries of TiN with a thin Al interlayer for Cu metallization
KT Nam et al.
APPLIED PHYSICS LETTERS (2001)
Diffusion barrier properties of ZrN films in the Cu/Si contact systems
MB Takeyama et al.
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B (2000)
分享论文
