期刊
JAPANESE JOURNAL OF APPLIED PHYSICS
卷 51, 期 1, 页码 -出版社
IOP PUBLISHING LTD
DOI: 10.1143/JJAP.51.01AH01
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- EC
The requirements for using carbon nanotubes as vias and interconnects are described. The growth of high density forests of vertically-aligned carbon nanotubes for interconnect applications by chemical vapor deposition is described. Densities up to 1.4 x 10(13) cm(-2) have been achieved by maintaining a small nanotube diameter. The process integration devices is reviewed. (C) 2012 The Japan Society of Applied Physics
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