Characterization of nanostructured thermal interface materials - A review

Due to high heat dissipation rates in current and projected future semiconductor devices, much attention has been given to improving paths of heat transport within the device package. A key focus is on improved thermal interface materials (TIMs), used in joining surfaces in a microelectronic package to reduce interface thermal resistance. Recently, due to the reported enhanced thermal performance of nanostructured materials, research has focused on using these materials as TIMs, or incorporating them within existing TIMs to improve thermal transport. We describe recent efforts in development and characterization of nanostructured TIMs and identify possible future research directions. (C) 2011 Elsevier Masson SAS. All rights reserved.