4.7 Article

A polycrystal plasticity model for predicting mechanical response and texture evolution during strain-path changes: Application to beryllium

期刊

INTERNATIONAL JOURNAL OF PLASTICITY
卷 49, 期 -, 页码 185-198

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijplas.2013.03.008

关键词

Hexagonal metals; Constitutive modeling; Twinning; De-twinning; Strain-path change

资金

  1. Seaborg Institute under a Post-Doctoral Fellowship through the LANL LDRD Program
  2. US. Department of Energy
  3. US Department of Energy, Office of Basic Energy Sciences [FWP-06SCPE401]

向作者/读者索取更多资源

A polycrystalline material, deformed to large plastic strains and subsequently reloaded along a distinct strain path, exhibits a change in flow stress and hardening behavior. Such changes upon reloading depend on the level of mechanical anisotropy induced by texture and sub-grain microstructure developed during prior loading. In order to comprehend such material behavior, we extend a previously developed rate- and temperature-sensitive hardening law for hexagonal single crystals that accounts explicitly for the evolution of dislocation densities by including the effects of reverse dislocation motion and de-twinning on strain hardening and texture evolution. The law is implemented within a visco-plastic self-consistent polycrystalline model and applied to simulate macroscopic behavior of polycrystalline beryllium during strain-path changes. We show that the model successfully captures the mechanical response and evolution of texture and twin volume fraction during pre-loading in compression and subsequent cross-reloading in compression along two orthogonal directions at two different strain rates. These predictions allow us to elucidate the role played by various slip and twin mechanisms, de-twinning, and reverse dislocation motion on strain hardening and texture evolution of beryllium during strain-path changes. The model is general and can be applied to any metal deforming by slip and twinning. (c) 2013 Elsevier Ltd. All rights reserved.

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