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注意:仅列出部分参考文献,下载原文获取全部文献信息。Development of Sn-Zn lead-free solders bearing alloying elements
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Ahmed Sharif et al.
MICROELECTRONIC ENGINEERING (2007)
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YS Kim et al.
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Wetting interaction between Sn-Zn-Ag solders and Cu
KL Lin et al.
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Advances in lead-free electronics soldering
K Suganuma
CURRENT OPINION IN SOLID STATE & MATERIALS SCIENCE (2001)
Lead-free solders in microelectronics
M Abtew et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2000)
The effects of flux on the wetting characteristics of near-eutectic Sn-Zn-In solder on Cu substrate
SP Yu et al.
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