Predictive modeling of undeformed chip thickness in ceramic grinding

The quality of the surface produced during ceramic grinding is important as it influences the performance of the finished part to great extent. The undeformed chip thickness is a variable often used to describe the quality of ground surfaces as well as to evaluate the competitiveness of the overall grinding system. Hence, the estimation of undeformed chip thickness can cater to the requirements of performance evaluation. But, the undeformed chip thickness is governed by many factors and its experimental determination is laborious and time consuming. So the establishment of a model for the reliable prediction of undeformed chip thickness is still a key issue for ceramic grinding. In this study, a new undeformed chip-thickness model is developed, for the reliable prediction of undeformed chip thickness in ceramic grinding, on the basis of stochastic nature of the grinding process, governed mainly by the random geometry and the random distribution of cutting edges. The model includes the real contact length that results from combined contact length, due to wheel-workpiece contact zone deflection and the local deflection due to the microscopic contact at the grain level and contact length due to geometry of depth of cut. The mechanical properties of workpiece material and the grinding parameters are also considered in the undeformed chip thickness model through normal grinding force model. The new model has been validated by the experimental results of silicon carbide grinding, taking the surface roughness as a parameter of evaluation. (c) 2012 Elsevier Ltd. All rights reserved.