期刊
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
卷 51, 期 1, 页码 18-24出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.ijmachtools.2010.10.006
关键词
Silicon wafer; Surface finish; Subsurface damage; Grinding
资金
- University of Queensland (UQ)
- Australia Research Council (ARC)
- Department of Industry, Innovation, Science and Research (DIISR)
- National Natural Science Foundation of China [50805017]
- Science and Technology Project of Liaoning Province of China [2008T222]
- Science and Technology Project of Dalian City in China [2009A18GX014]
- Open Foundation of SKLSP [201007]
An ultrafine diamond wheel of a mesh size of 12,000 was fabricated by using a hybrid bond material, which consists of silicon carbide, silica and alumina. The employment of the newly developed wheel enabled excellent performance during grinding of silicon wafers. An extremely smooth surface of an average roughness of 0.6 nm was achieved. TEM examinations showed that the total thickness of the defected layer was less than 60 nm. (C) 2010 Elsevier Ltd. All rights reserved.
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