期刊
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
卷 78, 期 -, 页码 45-49出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijheatmasstransfer.2014.06.043
关键词
Multiscale modeling; Thermal properties; Nano-interface
资金
- National Natural Science Foundation of China [61076098]
- Jiangsu Province Science Foundation for Youths [BK20130537]
- Innovative Foundation for Doctoral candidate of Jiangsu Province [CXLX12_0622, CXZZ13_0655]
- Natural Science Foundation of Gangxi Advanced Manufacturing Key Laboratory [13-051-09-013K]
- Special Natural Science Foundation for Innovative Group of Jiangsu University
A multiscale modeling method is put forward to investigate the interfacial characteristic of copper nano interface structures. The ISE (Interface Stress Element) method is set as a coupling button to a span-scale model combined with MD (Molecular Dynamics) and FE (Finite Element) methods. Those three methods are effectively coupled by MD-ISE and ISE-FE handshake regions. The thermal properties of copper nano structures are investigated by using this multiscale model. The results show that the accuracy of the MD-ISE-FE model is better than that of MD-FE model; the thermal resistance decreases with the temperature increase. Compared with the MD-FE model, the MD-ISE-FE multiscale model can provide better accuracy to investigate the interface prosperities for MEMS design and manufacturing. (C) 2014 Elsevier Ltd. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据