期刊
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
卷 45, 期 7-8, 页码 704-713出版社
SPRINGER LONDON LTD
DOI: 10.1007/s00170-009-2004-0
关键词
Nd:YAG laser; Silicon carbide; Ceramic; Drilling
资金
- U. S. Department of Energy [DE-AC05-00OR22725]
The ability of lasers to carry out drilling processes in silicon carbide ceramic was investigated in this study. A JK 701 pulsed Nd:YAG laser was used for drilling through the entire depth of silicon carbide plates of different thicknesses. The laser parameters were varied in different combinations for a well-controlled drilling through the entire thickness of the SiC plates. A drilling model incorporating effects of various physical phenomena such as decomposition, evaporation-induced recoil pressure, and surface tension was developed. Such comprehensive model was capable of advance prediction of the energy and time required for drilling a hole through any desired depth of material.
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