4.4 Article

Review of substrate-integrated waveguide circuits and antennas

期刊

IET MICROWAVES ANTENNAS & PROPAGATION
卷 5, 期 8, 页码 909-920

出版社

INST ENGINEERING TECHNOLOGY-IET
DOI: 10.1049/iet-map.2010.0463

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资金

  1. European COST Action IC0803 RF/Microwave Communication Subsystems for Emerging Wireless Technologies (RFCSET)
  2. Italian Ministry of the University [2008HE84LJ]
  3. Torres Quevedo [PTQ-06-02-0555]
  4. Ministry of Science and Innovation Spain [TEC2008-02685/TEC]

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Substrate-integrated waveguide (SIW) technology represents an emerging and very promising candidate for the development of circuits and components operating in the microwave and millimetre-wave region. SIW structures are generally fabricated by using two rows of conducting cylinders or slots embedded in a dielectric substrate that connects two parallel metal plates, and permit the implementation of classical rectangular waveguide components in planar form, along with printed circuitry, active devices and antennas. This study aims to provide an overview of the recent advances in the modelling, design and technological implementation of SIW structures and components.

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