4.5 Article Proceedings Paper

Alpha-Particle Emission Energy Spectra From Materials Used for Solder Bumps

期刊

IEEE TRANSACTIONS ON NUCLEAR SCIENCE
卷 57, 期 6, 页码 3251-3256

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TNS.2010.2085015

关键词

Alpha particles; energy spectrum; ionization detectors; low-background; solder bumps

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The emitted alpha particle energy distribution from solder bumps can show substantial surface emission which has a large impact on the modeled SEU rate. State-of-the art alpha-particle detectors are required to measure the low emissivity and energy distribution.

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