期刊
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
卷 60, 期 3, 页码 845-860出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TMTT.2011.2178427
关键词
Automotive radar; millimeterwave silicon RFICs; packaging and interconnects; radar transceivers; antenna systems
资金
- German Federal Ministry of Education and Research (BMBF) [13N9820-13N9824]
The market for driver assistance systems based on millimeter-wave radar sensor technology is gaining momentum. In the near future, the full range of newly introduced car models will be equipped with radar based systems which leads to high volume production with low cost potential. This paper provides background and an overview of the state of the art of millimeter-wave technology for automotive radar applications, including two actual silicon based fully integrated radar chips. Several advanced packaging concepts and antenna systems are presented and discussed in detail. Finally measurement results of the fully integrated radar front ends are shown.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据