Dislocation density of pure copper processed by accumulative roll bonding and equal-channel angular pressing

The dislocation density of pure copper fabricated by two severe plastic deformation (SPD) processes, i.e., accumulative roll bonding and equal-channel angular pressing, was evaluated using scanning transmission electron microscopy/transmission electron microscopy observations. The dislocation density drastically increased from similar to 10(13) m(-2) to about 5 x 10(14) m(-2), and then saturated, for both SPD processes. (C) 2015 Elsevier Inc All rights reserved.