期刊
MATERIALS & DESIGN
卷 67, 期 -, 页码 209-216出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2014.11.036
关键词
Solder alloy; Aluminum; Microstructure; Wettability; Mechanical properties
资金
- National Natural Science Foundation of China [51401037]
- Science and Technology Program of Jiangsu Province of China [BK20141228]
- Science and Technology Program of Suzhou [SYG201421, SYG201348, SYG201251]
- Natural Science Foundation of the Jiangsu Higher Education Institutions of China [14KJB430001, 13KJB430001]
- Scientific Research Project of Changshu Institute of Technology [JXK2014003]
- Jiangsu Key Laboratory of Large Engineering Equipment Detection and Control [JSKLEDC201301]
The effect of aluminum concentration on the microstructure, wettability, interfacial IMC and mechanical properties of Sn-0.7Cu lead-free solder alloy is investigated. The results show that the microstructure of Sn-Cu-Al solder alloy consists of beta-Sn, eutectic and IMC, and the microstructure of Sn-0.7Cu alloy is refined by adding aluminum. The interfacial IMC at the boundary of b-Sn in the Sn-0.7Cu-(0.01-0.025)Al is Cu6Sn5, and it is varied to Al2Cu in the Sn-0.7Cu-(0.05-0.075) Al. The wettability of Sn-Cu-Al solder alloy is improved by aluminum, the spreading coefficient of Sn-0.7Cu-0.075Al reaches about 70%. The thickness of the scalloped interfacial IMC is dominated by the IMC variation, and the chemical reaction between Cu and segregated Al. The mechanical properties of Sn-Cu-Al solder alloy are decreased slightly by adding aluminum. The tensile strength and the creep resistance of Sn-0.7Cu-(0.05-0.075)Al are superior to Sn-0.7Cu-(0.01-0.025) Al due to the hindering dislocation slipping by the disperse Al2Cu. Sn-0.7Cu-(0.05-0.075)Al is an applicable lead-free solder alloy for the Cu substrate. (C) 2014 Elsevier Ltd. All rights reserved.
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