4.8 Article

Thermal Network Model of Supercapacitors Stack

期刊

IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
卷 59, 期 2, 页码 979-987

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TIE.2011.2158769

关键词

Heat transfer; sensitivity analysis; supercapacitors; thermal modeling

资金

  1. Direction Generale des Entreprises
  2. Region Rhone-Alpes

向作者/读者索取更多资源

In the field of urban transport, supercapacitors are submitted to relative high charge and discharge currents and therefore significant heat generation occurs. It has been shown that the temperature has a great influence on the aging mechanism of supercapacitors and, by consequence, on the lifetime of the system. That is why the thermal management becomes a key issue in the study of the performance of a supercapacitors stack. In this paper, thermal modeling of a supercapacitors stack is presented and a matrix representation of the model is deduced. Validation of the model has been carried out using measurement on a developed test bench. Sensitivity of the model according to input uncertainties is finally discussed.

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