期刊
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING
卷 31, 期 4, 页码 273-284出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TEPM.2008.2004570
关键词
Acoustic temperature sensing; polymer curing; rapid curing; variable frequency microwave curing; zinc oxide deposition
资金
- Office of Naval Research
- National Science Foundation
Variable-frequency microwave (VFM) curing can perform the same processing steps as conventional thermal processing in minutes, without compromising intrinsic material properties. With increasing demand for novel dielectrics, there is a corresponding demand for new processing techniques that lead to comparable or better properties than conventional methods. VFM processing can be a viable alternative to conventional thermal techniques. However, current limitations include a lack of reliable temperature measuring techniques. This research focuses on developing a reliable temperature measuring system using acoustic techniques to monitor low-k polymer dielectrics cured on silicon wafers in a VFM furnace. The acoustic sensor exhibits the capability to measure temperatures from 20 degrees C to 300 degrees C with an attainable accuracy of 2 degrees.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据