4.6 Article

All CVD Boron Nitride Encapsulated Graphene FETs With CMOS Compatible Metal Edge Contacts

期刊

IEEE TRANSACTIONS ON ELECTRON DEVICES
卷 65, 期 10, 页码 4129-4134

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2018.2865382

关键词

Boron nitride (BN); chemical vapor deposition (CVD); edge contacts; graphene; intrinsic voltage gain; mobility; radio frequency (RF); terahertz (THz); voltage amplifier

资金

  1. German Research Foundation [DFG LE 2440/2-1, LE 2440/3-1]
  2. EU Graphene Flagship [785219]

向作者/读者索取更多资源

We report on the fabrication and characterization of field-effect transistors (FETs) based on chemical vapor deposited (CVD) graphene encapsulated between few layer CVD boron nitride (BN) sheets with complementary metal-oxide-semiconductor (CMOS) compatible nickel edge contacts. Noncontact terahertz time-domain spectroscopy (THz-TDS) of large-area BN/graphene/BN (BN/G/BN) stacks reveals average sheet conductivity >1 mS/sq. and average mobility of 2500 cm(2)/V . s. Improved output conductance is observed in dc measurements under ambient conditions, indicating the potential for radio frequency (RF) applications. Moreover, we report a maximum voltage gain of 6 dB from a low-frequency signal amplifier circuit. RF characterization of the GFETs yields an f(T) x L-g product of 2.64 GHz . mu m and an f(Max) x L-g product of 5.88 GHz . mu m. This paper presents for the first time THz-TDS usage in combination with other characterization methods for device performance assessment on BN/G/BN stacks. The results serve as a step toward scalable, all CVD 2-D material-based FETs for CMOS compatible future nanoelectronic circuit architectures.

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