期刊
IEEE TRANSACTIONS ON ELECTRON DEVICES
卷 65, 期 9, 页码 3791-3795出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2018.2859277
关键词
Cu substrate; flexible electronics; thin-film transistors (TFTs); zinc oxide (ZnO)
资金
- National Natural Science Foundation of China [11674405, 11675280]
In this paper, we report the fabrication of flexible ZnO thin-film transistors (TFTs) on the 25-mu m-thick copper substrate. The Cu substrate compatible with high-temperature processes was deposited by electroplating, which led to a smooth surface. The ZnO layer was deposited at room temperature, and a thermal annealing process was conducted at 300 degrees C in the air after the fabrication of TFTs. The threshold voltage, hysteresis voltage, and contact resistance are improved after annealing, whereas the mobility, subthreshold swing, and ON/OFF ratio are barely changed. The stabilities of ZnO TFTs are also enhanced, evidenced by the smaller threshold voltage shifts induced by positive and negative gate bias stresses. The field-effect mobility, threshold voltage, and subthreshold swing are stable even when exposed to a mechanical tensile strain up to 1.25% and 10 000 bending cycles.
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