High Integration Density Capacitors Directly Integrated in a Single Copper Layer of Printed Circuit Boards

Direct integration of capacitors in printed circuit boards with high integration densities and electrical properties comparable to surface mount ceramic capacitors is reported, achieving a device-yield of >90%. The insulation properties are determined through a self assembled monolayer, whereas the dielectric properties are defined by a ceramic thin-film fabricated from chemically modified highly crystalline BaTiO3 and ZrO2 nanoparticles.