4.5 Article

Accurate Direct and Indirect On-Chip Temperature Sensing for Efficient Dynamic Thermal Management

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCAD.2010.2061310

关键词

Multiprocessor SoC; sensor placement; temperature difference; thermal management; thermal sensor

资金

  1. NSF [0821155, 0916127, 1029783]
  2. SRC [P11816]
  3. MuSyC
  4. DARPA
  5. UC Micro
  6. IBM
  7. Texas Instruments
  8. Oracle
  9. Qualcomm
  10. Cisco
  11. UCSD Center for Networked Systems
  12. Direct For Computer & Info Scie & Enginr
  13. Division Of Computer and Network Systems [821155] Funding Source: National Science Foundation
  14. Division of Computing and Communication Foundations
  15. Direct For Computer & Info Scie & Enginr [0916127] Funding Source: National Science Foundation

向作者/读者索取更多资源

Dynamic thermal management techniques require accurate runtime temperature information in order to operate effectively and efficiently. In this paper, we propose two novel solutions for accurate sensing of on-chip temperature. Our first technique is used at design time for sensor allocation and placement to minimize the number of sensors while maintaining the desired accuracy. The experimental results show that this technique can improve the efficiency and accuracy of sensor allocation and placement compared to previous work and can reduce the number of required thermal sensors by about 16% on average. Secondly, we propose indirect temperature sensing to accurately estimate the temperature at arbitrary locations on the die based on the noisy temperature readings from a limited number of sensors which are located further away from the locations of interest. Our runtime technique for temperature estimation reduces the standard deviation and maximum value of temperature estimation errors by an order of magnitude.

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