期刊
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
卷 29, 期 10, 页码 1586-1599出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCAD.2010.2061310
关键词
Multiprocessor SoC; sensor placement; temperature difference; thermal management; thermal sensor
类别
资金
- NSF [0821155, 0916127, 1029783]
- SRC [P11816]
- MuSyC
- DARPA
- UC Micro
- IBM
- Texas Instruments
- Oracle
- Qualcomm
- Cisco
- UCSD Center for Networked Systems
- Direct For Computer & Info Scie & Enginr
- Division Of Computer and Network Systems [821155] Funding Source: National Science Foundation
- Division of Computing and Communication Foundations
- Direct For Computer & Info Scie & Enginr [0916127] Funding Source: National Science Foundation
Dynamic thermal management techniques require accurate runtime temperature information in order to operate effectively and efficiently. In this paper, we propose two novel solutions for accurate sensing of on-chip temperature. Our first technique is used at design time for sensor allocation and placement to minimize the number of sensors while maintaining the desired accuracy. The experimental results show that this technique can improve the efficiency and accuracy of sensor allocation and placement compared to previous work and can reduce the number of required thermal sensors by about 16% on average. Secondly, we propose indirect temperature sensing to accurately estimate the temperature at arbitrary locations on the die based on the noisy temperature readings from a limited number of sensors which are located further away from the locations of interest. Our runtime technique for temperature estimation reduces the standard deviation and maximum value of temperature estimation errors by an order of magnitude.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据