4.6 Article

Engineering Challenges for Instrumenting and Controlling Integrated Organ-on-Chip Systems

期刊

IEEE TRANSACTIONS ON BIOMEDICAL ENGINEERING
卷 60, 期 3, 页码 682-690

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TBME.2013.2244891

关键词

Artificial biological organs; biological systems; biotechnology; systems biology

资金

  1. Defense Threat Reduction Agency [HDTRA1-09-1-00-13, DTRA100271 A-5196]
  2. National Institutes of Health [R01GM092218, RC2DA028981]
  3. NIH Common Fund [1UH2-TR000491-01]
  4. Defense Advanced Research Projects Agency [W911NF-12-2-0036]
  5. Vanderbilt University Discovery Grant
  6. Vanderbilt Institute for Integrative Biosystems Research and Education

向作者/读者索取更多资源

The sophistication and success of recently reported microfabricated organs-on-chips and human organ constructs have made it possible to design scaled and interconnected organ systems that may significantly augment the current drug development pipeline and lead to advances in systems biology. Physiologically realistic live microHuman (mu Hu) and milliHuman (mHu) systems operating for weeks tomonths present exciting and important engineering challenges such as determining the appropriate size for each organ to ensure appropriate relative organ functional activity, achieving appropriate cell density, providing the requisite universal perfusion media, sensing the breadth of physiological responses, and maintaining stable control of the entire system, while maintaining fluid scaling that consists of similar to 5 mL for the mHu and similar to 5 mu L for the mu Hu. We believe that successful mHu and mu Hu systems for drug development and systems biology will require low-volume microdevices that support chemical signaling, microfabricated pumps, valves and microformulators, automated optical microscopy, electrochemical sensors for rapid metabolic assessment, ion mobility-mass spectrometry for real-time molecular analysis, advanced bioinformatics, and machine learning algorithms for automated model inference and integrated electronic control. Toward this goal, we are building functional prototype components and are working toward top-down system integration.

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