期刊
IEEE TRANSACTIONS ON BIOMEDICAL ENGINEERING
卷 59, 期 11, 页码 3050-3059出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TBME.2012.2213252
关键词
Amplitude modulation (AM); bone anchored hearing aid (BAHA); bone conduction devices; bone conduction implant (BCI); class-e power amplifier; implantable hearing devices; implantable transducer; low-power systems; radio frequency (RF) power; data link
资金
- VINNOVA, Swedish Governmental Agency for Innovations Systems
This paper presents analysis and design of a radio frequency power and data link for a novel Bone Conduction Implant (BCI) system. Patients with conductive and mixed hearing loss and single-sided deafness can be rehabilitated by bone-anchored hearing aids (BAHA). Whereas the conventional hearing aids transmit sound to the tympanic membrane via air conduction, the BAHA transmits sound via vibrations through the skull directly to the cochlea. It uses a titanium screw that penetrates the skin and needs life-long daily care; it may cause skin infection and redness. The BCI is developed as an alternative to the percutaneous BAHA since it leaves the skin intact. The BCI comprises an external audio processor with a transmitter coil and an implanted unit called the bridging bone conductor with a receiver coil. Using amplitude modulation of the Class-E power amplifier that drives the inductive link, the sound signal is transmitted to the implant through the intact skin. It was found that the BCI can generate enough output force level for candidate patients. Maximum power output of the BCI was designed to occur at 5-mm skin thickness and the variability was within 1.5 dB for 1-8-mm skin thickness variations.
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