期刊
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION
卷 61, 期 4, 页码 1623-1630出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TAP.2012.2232895
关键词
Antenna-in-package; electronic packaging; printed antenna; 60 GHz antennas
资金
- National Science Foundation [ECCS-1027703]
- Directorate For Engineering
- Div Of Electrical, Commun & Cyber Sys [1027703] Funding Source: National Science Foundation
This paper presents the design of a 60 GHz antenna to be used in multi-core multi-chip (MCMC) computing systems. The antenna in package (AiP) solution has a ground-shielded metal and a periodically-patched artificial magnetic conductor (AMC) structure to widen the reflection coefficient bandwidth. The designed antenna with AMC layer broadcasts signals in the horizontal direction. Both simulated and measured results demonstrate that a -10 dB reflection coefficient is achieved for a 10 GHz bandwidth and that radiation in the horizontal (chip-to-chip) direction is maintained.
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