4.7 Article

The Design of Broadband 60 GHz AMC Antenna in Multi-Chip RF Data Transmission

期刊

IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION
卷 61, 期 4, 页码 1623-1630

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TAP.2012.2232895

关键词

Antenna-in-package; electronic packaging; printed antenna; 60 GHz antennas

资金

  1. National Science Foundation [ECCS-1027703]
  2. Directorate For Engineering
  3. Div Of Electrical, Commun & Cyber Sys [1027703] Funding Source: National Science Foundation

向作者/读者索取更多资源

This paper presents the design of a 60 GHz antenna to be used in multi-core multi-chip (MCMC) computing systems. The antenna in package (AiP) solution has a ground-shielded metal and a periodically-patched artificial magnetic conductor (AMC) structure to widen the reflection coefficient bandwidth. The designed antenna with AMC layer broadcasts signals in the horizontal direction. Both simulated and measured results demonstrate that a -10 dB reflection coefficient is achieved for a 10 GHz bandwidth and that radiation in the horizontal (chip-to-chip) direction is maintained.

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