期刊
IEEE TRANSACTIONS ON ADVANCED PACKAGING
卷 31, 期 4, 页码 759-767出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TADVP.2008.2005996
关键词
Assembly; connectors; fabrication; high-speed integrated circuits; laser machining; multimode waveguides; optical interconnections; optical polymers; optical receivers; optical transmitters; reliability; technology
On the basis of a realized 12 X 10 Gb/s card-to-card optical link demonstrator, the capabilities of a polymer-waveguide-based board-level optical interconnect technology are presented. The conception and realization of the modular building blocks required for this board-level optical interconnect technology are described in detail. In particular, we report on the fabrication and characterization of board-integrated optical low-loss polymer waveguides that are compatible with printed circuit board (PCB) manufacturing processes. We also explain our fully passive alignment technique, superseding time-consuming active positioning of components and connectors. To realize optical transceiver modules comprising vertical cavity surface emitting laser (VCSEL) arrays with laser drivers and photodetector arrays with transimpedance amplifiers (TIAs), a mass-production concept based on wafer-level processing has been elaborated and successfully implemented.
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