期刊
IEEE ELECTRON DEVICE LETTERS
卷 39, 期 10, 页码 1612-1615出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2018.2868092
关键词
Aligned packaging; frequency selective surface (FSS); multi-layer
An aligned eight-layer honeycomb-shaped frequency selective surface (FSS) has been designed and fabricated to pass and reject electromagnetic waves at 183 and 118 GHz, respectively. To reduce the shifts between layers, an aligned packaging method was introduced based on photolithography and laser drilling techniques. The transmission properties of FSSs with different numbers of layers were investigated from 110 to 220 GHz. Good agreements were observed between experimental and simulated results in all the cases, among which an optimized selectivity, with an insertion loss 1.35 dB at 183 GHz and a rejection 28.6 dB at 118 GHz, was obtained by the eight-layer one.
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