期刊
IEEE ELECTRON DEVICE LETTERS
卷 39, 期 10, 页码 1548-1551出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2018.2864874
关键词
Lateral GaN Schottky barrier diode; tungsten anode; breakdown; power figure-of-merit
资金
- National Key Research and Development Program [2016YFB0400100]
- National Key Science and Technology Special Project [2017ZX01001301]
- National Natural Science Foundation of China [11435010, 61474086]
- Natural Science Basic Research Program of Shaanxi [2016ZDJC-02]
In this letter, we report the achievement of a high-performance lateral GaN Schottky barrier diode (SBD) on a silicon substrate with a low turn-ON voltage (V-ON) of 0.35 V and tungsten (W) as the anode. Non-field-plated lateral GaN SBDs with the anode-cathode distances (L-AC) of 6, 10, 15, 20, and 25 mu m demonstrate the reverse breakdown voltages of 0.6, 1.1, 1.25, 1.5, and 1.9 kV with the differential specific ON-resistances (R-ON,R-sp) of 0.38, 0.72, 1.23, 1.87, and 2.61 m Omega.cm(2), respectively. The power figure-of-merit (FOM) is calculated to be 1 x 10(3), 1.7 x 10(3), 1.3 x 10(3), 1.2 x 10(3), and 1.4 x 10(3) MW/cm(2). To the best of our knowledge, this FOM of 1.7 x 10 3 MW/cm(2) is the highest among all the lateral GaN SBDs on a Si substrate. Combined with the similar to 10(8) current ON/OFF ratio at room temperature, the GaN SBD with the W anode shows a great promise for next-generation power electronics.
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