4.6 Article

InAlN/AlN/GaN HEMTs With Regrown Ohmic Contacts and fT of 370 GHz

期刊

IEEE ELECTRON DEVICE LETTERS
卷 33, 期 7, 页码 988-990

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2012.2196751

关键词

AlN; cutoff frequency; f(T); GaN; high-electron-mobility transistor (HEMT); InAlN; molecular beam epitaxy (MBE); regrown ohmic contacts; transistor

资金

  1. Defense Advanced Research Projects Agency [HR0011-10-C-0015]
  2. Air Force Office of Scientific Research

向作者/读者索取更多资源

We report 30-nm-gate-length InAlN/AlN/GaN/SiC high-electron-mobility transistors (HEMTs) with a record current gain cutoff frequency (f(T)) of 370 GHz. The HEMT without back barrier exhibits an extrinsic transconductance (g(m. ext)) of 650 mS/mm and an on/off current ratio of 10(6) owing to the incorporation of dielectric-free passivation and regrown ohmic contacts with a contact resistance of 0.16 Omega . mm. Delay analysis suggests that the high f(T) is a result of low gate-drain parasitics associated with the rectangular gate. Although it appears possible to reach 500-GHz f(T) by further reducing the gate length, it is imperative to investigate alternative structures that offer higher mobility/velocity while keeping the best possible electrostatic control in ultrascaled geometry.

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