期刊
IEEE ELECTRON DEVICE LETTERS
卷 30, 期 12, 页码 1254-1256出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2009.2032938
关键词
GaN; high-k dielectric; high-electron mobility transistor (HEMT); self-aligned
资金
- Office of Naval Research
- M/A-COM Corporation
This letter describes a gate-first AlGaN/GaN high-electron mobility transistor (HEMT) with a W/high-k dielectric gate stack. In this new fabrication technology, the gate stack is deposited before the ohmic contacts, and it is optimized to stand the 870 degrees C ohmic contact annealing. The deposition of the W/high-k dielectric protects the intrinsic transistor early in the fabrication process. Three different gate stacks were studied: W/HfO2, W/Al2O3, and W/HfO2/Ga2O3. DC characterization showed transconductances of up to 215 mS/mm, maximum drain current densities of up to 960 mA/mm, and more than five orders of magnitude lower gate leakage current than in the conventional gate-last Ni/Au/Ni gate HEMTs. Capacitance-voltage measurements and pulsed-IV characterization show no hysteresis for the W/HfO2/Ga2O3 capacitors and low interface traps. These W/high-k dielectric gates are an enabling technology for self-aligned AlGaN/GaN HEMTs, where the gate contact acts as a hard mask to the ohmic deposition.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据