[IEEE Transactions on Components Packaging and Manufacturing Technology] - What are all the reasons for wirebonds deformations or disturbances inside the sealed and screening completed microelectronics?
未回答
This is regarding Hybrid Micro Circuits failure analysis, during our failure analysis, we cut open the microcircuit and found wire bond disturbance. What are all the reasons for wirebonds deformations or disturbances inside the hermitically sealed and screening completed microelectronics?
登录以回答这个问题
分享
相关问题
Find the ideal target journal for your manuscript
Explore over 38,000 international journals covering a vast array of academic fields.
Search